Material: High-purity fused quartz (SiO₂)
Applications: Semiconductors, precision optics, UV lithography, spectroscopy, laser systems, high-temperature processing
1. Optical Properties
Parameter |
Typical Value |
Notes / Applications |
Wavelength Range |
190–2500 nm |
Deep UV to near-infrared |
Transmittance @ 200 nm |
>80% |
UV optics, spectroscopy |
Transmittance 260–2000 nm |
>90% |
Visible to near-IR applications |
Surface Quality (S/D) |
40/20 – 20/10 |
Optical-grade wafers for coating or laser systems |
Refractive Index |
1.458–1.460 (at 589 nm) |
Stable across temperature and wavelength |
Bubble / Inclusion Level |
Minimal / None visible |
Critical for high-precision optics |
Notes: Quartz wafers maintain excellent transmission in the deep UV (<260 nm), outperforming ordinary glass for UV lithography and laser applications.
2. Chemical Properties
Parameter |
Typical Value |
Notes / Applications |
Material Composition |
>99.99% SiO₂ |
High-purity fused quartz |
Acid Resistance |
Excellent (except HF) |
Semiconductor wet etching, chemical labware |
Alkali Resistance |
Excellent |
Maintains optical clarity in basic solutions |
Oxidation Resistance |
High |
Suitable for high-temperature and oxidative environments |
Notes: Quartz wafers act as a chemically stable barrier, preserving optical and mechanical integrity under harsh conditions.
3. Purity and Impurity Control
Parameter |
Typical Value |
Notes / Applications |
Metal Impurities |
<1 ppm (Na, K, Fe) |
Ultra-pure quartz minimizes ionic contamination in IC fabrication |
High-Temperature Ion Stability |
No mobile ion release |
Critical for semiconductor and optical fiber manufacturing |
Manufacturing Process |
Chloride refining + high-temperature purification |
Ensures ultra-low contamination and stable optical properties |
4. Thermal Properties
Parameter |
Typical Value |
Notes / Applications |
Coefficient of Thermal Expansion (CTE) |
~5.5×10⁻⁷/K |
Excellent thermal shock resistance |
Softening Point |
~1665 °C |
High-temperature furnace applications |
Maximum Continuous Operating Temperature |
1100 °C |
Suitable for high-temperature optics, laser windows |
Thermal Conductivity |
~1.38 W/m·K |
Reduces temperature gradient stress |
Notes: Quartz wafers remain dimensionally stable and mechanically robust under high thermal loads, unlike ordinary glass.
5. Typical Surface & Geometrical Specifications
Parameter |
Standard Values |
Diameter Tolerance |
±0.01 mm (or better) |
Thickness Tolerance |
±0.01 mm (or better) |
Total Thickness Variation (TTV) |
≤5 µm for high-end optics |
Warp / Bow |
≤25 µm typical |
Edge Chamfer |
Standard 0.2–0.5 mm, reduces breakage risk |
Surface Roughness (Ra) |
≤0.5 nm |
6. Summary of Key Advantages
Ultra-wide spectral transmittance: Deep UV to near-IR
Exceptional chemical stability: Resistant to acids (except HF) and oxidation
High purity: Minimizes ionic contamination for microelectronics
Thermal stability: Low CTE, high softening point, excellent shock resistance
Precision processing: Tight geometrical and surface tolerances for advanced optics
7. Customization and Supply
Diameter, thickness, and surface finish can be tailored to customer specifications
High-volume supply with batch consistency and full testing reports
Supports
optical windows, UV lithography, laser optics, semiconductor substrates, and high-temperature applicationsConclusion: Selecting high-quality
quartz wafers ensures
optical clarity, chemical robustness, and thermal stability, providing reliable performance in advanced manufacturing and research applications.